Title
University Voucher MSR_Addisu Negash Ali
Solver
Start year
2025
End year
2028
Provider
Moravskoslezský kraj
Category
Obecná forma
Type
Vouchery pro univerzity – Moravskoslezský kraj
Summary
Power electronics devices have wide ranges of applications in the automotive, renewable energy, data centers, and others. However, the advancements towards high-power density power electronics and the emerging of wide bandgap semiconductor materials create thermal management challenges. The existing thermal management methods use air and liquid-based large-scale cooling technologies, which cannot remove the miniatures’ junction temperature and thermal cycling stress that reduce the performance and cause the failure of most power electronics components. Furthermore, the existing cooling technologies have drawbacks of increasing the overall power electronics systems’ size, the thermal resistance of integrated heat dissipating systems, and unbalanced heat removal from each power electronics component. To develop innovative heat dissipating technologies for high power density and miniaturized power electronics devices, high thermal conductivity (TC), TC anisotropy, uniform heat dissipation, low thermal expansion coefficient (TEC) mismatch, lightweight structure, scalable size, and high strength are key determining parameters. In the HyPerCooling-AM project, the hybrid coated micron-sized carbon fiber/Al anisotropic composites will be developed by considering the key determining parameters to accommodate the thermal management challenges in the future perspectives of power electronics devices. The HyPerCooling-AM project considers the standard experimental and theoretical procedures to ensure the scalability and reputability of the research activities and outputs. Finally, the research data will be deposited at the university repository system and the outputs will be published at high impact journals by considering the FAIR principles.